On the line, the wafer runs through soft bake, hard bake, and curing—no wiggle room for drift. A 2°C hotspot in the photoresist bake can print a bridge across a node. A cold edge in drying can trap a bead that shows up later as a fatal particle. Out here, reliability isn’t a slogan—it’s yield lost per hour. What we focus on, technically, is tight thermal control. We build wafer heaters around ±0.1°C uniformity across the chuck, ramp profiles you can count on, and setpoints that stay put under load. Quartz halogen lamps give fast, clean response with minimal outgassing, and closed-loop sensors keep temperature on target—not just on the display. Cleanroom Class 1–100 compatibility is engineered in: low-particle materials, sealed junctions, and exhaust routing that keeps contaminants out of the chamber. We don’t claim “zero particle generation.” We specify it, measure it, and verify it against process monitors. Why this matters on the floor: in wafer drying and cleaning, the heater dries surfaces without thermal shock—fewer defects, less rework. In lithography, it nails soft bake and hard bake with photoresist-grade repeatability, so CD control and sidewall profiles stay in spec. In packaging, it delivers controlled curing and encapsulation without overshooting the thermal budget. The payoff is straightforward: fewer scrap lots, SPC charts that don’t jump around, and energy use that follows the process—not the heater. A few things you’ll want to get right. The heater integrates with standard OEM platforms, but the chuck flatness and contact geometry have to match the spec. Commissioning is quick, but you’ll still need to tune ramp rates and overshoot for your resist stack. If you’re running in a high-humidity bay, pay attention to condensate management at the exhaust port. Once everything’s aligned, the system runs 24/7 with predictable maintenance—lamps, sensors, seals—without surprise downtime.